History

［Ultex Corporation］ is established for developing and spreading the advanced ultrasonic (SoundPower) technologies

New bonding tech of Aluminum to Ceramics is announced

First ever adoption of our “Sound Metal Bonding technology” for mass production of the worldʼs first produced Sony’s （Mass production which contributes to the Nobel Prize in 2019 is started）

Adoption of “Sound Rotary technology” for mass production of <Ni-MH batteries used in hybrid car PRIUS> （Mass production of hybrid cars is started）

<Flip-Chip> bonding technology with Sound and Heat horn is announced

At the Internepcon Japan, publication of “Flip-Chip Bonding by Sound Bonding Machine with DSS Structure”

Flip-Chip tech is adopted by the ［Association of Super-Advanced Electronics Technologies］ ASET/NEDO and “3D mounted device tech” is announced in 2003

A few semi-conductor manufacturers begin <mass production of multi-bump IC packages> with “Sound Flip-Chip Bonder tech”

Adoption of “Sound Bonding technology” in mass production of <power control unit> used in <hybrid car LEXUS>

Adoption of “Sound Soldering technology” in mass production of assembly

Mass production of <Lithium Ion batteries used in Honda HV> is started by adoption of Sound Metal Bonding system

Bonding of Aluminum and Copper over 4mm thick becomes a possibility with Sound Metal Bonding system

“SoundBonding ribbon bonder” that bonding of metal ribbon becomes a possibility, is announced

<Bonding of Tin-plated parts> becomes a possibility with SoundBonding system

Bonding of <Aluminum wiring harness having 100sqmm> becomes a possibility with SoundBonding system

[Vertical Vibration Bonding] VVB can bond materials such as different materials of metal, is invented

New SoundPower bonding technology [Clip Ingot Bonding/CIB] that bonding marks don’t remain to applications, is invented

<Bonding of SiC elements to heat sink at 4 points by one shot> becomes a possibility

[MST/Multi-Step Tool] for CIB tech is developed and bonding of 100 foil for LIB at 2 points by one shot becomes a possibility

[3-dimensional hermetic sealing bonding] tech with VVB・HVB is developed

[Energy Concentration Bonding/ECB] tech becomes a possibility even in Steels bonding , is developed

[DoublePower system] that output about 10000 watt is the largest in the world is developed

2020 Intermittent vibration type [Stitch Rotation] which is Rotary bonding tech, is developed

SoundBonding tech [PHE/Prevention of Hydrogen Embrittlement] is developed for Tin-plated steels bonding

Succeed in <Bonding of Superconductive materials>

Succeed in <Bonding of different materials, Silicon nitride substrate and Ni-plated Cu heat sink by one shot>

Succeed in [3D Hermetic Bonding] of Assembly of cooling chiller tank structure

Succeed in <Very strong bonding of between Galvanized high-tensile strength steels >

Succeed in the development of SoundCutting tech. which reduces the wear of diamond cutting blade significantly

3D with VVB tech becomes a possibility

Aluminium plate and electrical steel plate bonding becomes a possibility

Terminal and electrode making by <Aluminium and Copper thick plate and block bonding> becomes a possibility