Products
SoundPower
Laboratory Line
All LAB systems are available in our laboratory
Only power, air, and water are required.
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01 Bonding
Bonding
Our SoundBonding systems
Utilizing the power of sound to create interatomic bonds between parts while in the atmosphere and at room temperature.
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BondingNo Voids
Sound bonding system
DSS that both ends of the hornare supported
- No contamination in bonding
- Rigid DSS bonding machine
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BondingNo Voids
Sound & Heat Bonder
With heated horn for bonding
- Bonding machine using both sound and heat
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BondingNo Voids
Sound ribbon bonder
For power semiconductors Bonding machine for metal ribbon
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BondingNo Voids
Sound Double Power System
With two generators
- The DSS Double Power System with output power of up to 10,000 W
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02 Soldering
Soldering
Our SoundSoldering and cleansing systems
Utilizing the power of sound to create interatomic bonds between solder and parts.
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03 Rotation
Rotation
Our RotationalBonding systems
Utilizing the power of sound and rotational motion to create continuous bonded seams.
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RotationNo Voids
Sound rotation system
Consecutive bonding for elec- trodes of batteries
and others For speedy production lines This system
can also be used as batch type- Rotation bonding machine
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RotationNo Voids
Sound rotation reel to reel system
For consecutive bonding Reel to reel bonding machine
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04 Cutting
Cutting
Our SoundCutting systems
Utilizing the power of sound for damage-free cuts in either atmosphere or liquid.
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Cutting
Sound cutting system
Diamond cutting machine for semiconductors and general difficult-to-cut materials
- Only water is used
- SiC can be cut
- No occurrence of built-up edge
- No need of dressing
- No need of LLC for cooling
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Cutting
Strong sound cleaning system
Soft direct drive type cleaning machine by dip method with water
- Direct cleaning with the strong horn
- No damages to parts
- Cavitation generated byparts’ self No need of aqueous specialized cleaning liquid
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