A sonic soldering technology that uses sound energy in the solder to achieve the bonding between atoms in space.
Non-flux soldering technology, soldering without using flux.

Soldering Features

  1. Damage-free dip soldering method with lead-free support that requires no flux
  2. Diffusion and interatomic bonding in alloy state are possible
  3. Soldering to copper, iron, nickel, aluminum, etc. possible (solder dedicated to aluminum not required)
  4. No secular change after soldering
  5. No residual stress in the joint
  6. Micro-soldering without bridging or voids
  7. No occurrence of dendrites (whiskers)
  8. Possible to suppress solder ball generation

Vertical Soldering Method (1)

Vertical Soldering Method (2)

CSS dipping parts



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