SoundSoldering - ULTEX SoundPowerアルテクスサウンドパワー金属接合は超音波から音波へ

A sonic soldering technology that uses sound energy in the solder to achieve the bonding between atoms in space.
Non-flux soldering technology, soldering without using flux.

Soldering Features

Damage-free dip soldering method with lead-free support that requires no flux
Diffusion and interatomic bonding in alloy state are possible
Soldering to copper, iron, nickel, aluminum, etc. possible (solder dedicated to aluminum not required)
No secular change after soldering
No residual stress in the joint
Micro-soldering without bridging or voids
No occurrence of dendrites (whiskers)
Possible to suppress solder ball generation

See soldering system

See soldering applications