SoundCutting

We break common sense of cutting technology until now

For example, in semiconductor field, to cut materials such as Silicon wafer using diamond particles which is crushed and drop out called has been common sense until now. But facility expansion is required with production expansion. As a result, in reality, it is [wasteful production process] to consume blades.
As Ultex’s basic idea about “manufacture”, we rationalize by increasing production efficiency and efficiency of back-end process with production expansion in innovative technology.
By pursuing cutting process of soft・hard・difficult-to-cut materials in the theme of SoundCutting and using SoundPower, the cutting innovative elemental technology has been put in
practical use.