Technologies

02 Soldering

Soldering

No flux needed Dip tinning technology

SoundSoldering utilizes the power of sound to create interatomic bonds between solder and parts. This allows to tin parts without the need for flux.

SoundSoldering features
  • Flux and lead free dip tinning with zero damage
  • Diffusion or alloy bonded interatomic connections
  • Tinning copper, iron, nickel, aluminium, etc. is possible (without the need for special aluminium solder)
  • No deterioration of soldered connections
  • No residual stress
  • Micro soldering without bridges or voids
  • No dendrites (whiskers)
  • Solder ball formation is suppressed to a minimum
Soldering videos

  • Vertical tinning process (1)

  • Vertical tinning process (2)

  • CSS dipping parts