Ultex has been at the forefront of sound energy research for over 35 years. This dedication has led to the development of our world-class SoundPower hardware and applications.
Today, these solutions are used across a wide range of manufacturing environments.
We remain committed to ever-greater technological innovation and continued breakthroughs.

• 1990

  Ultex Corporation is established to develop and popularize ultrasonic (SoundPower) manufacturing technologies.

• 1990

  A new bonding technology for aluminium and ceramics is unveiled.

• 1992

  Ultex SoundBonding technology is selected for the world’s first mass-production of lithium-ion batteries.

• 1995

  The Dual Support System (DSS) is introduced.

• 1997

  SoundBonding is chosen for use in power module mass production for the first time.

• 1998

  A major Japanese automaker selects SoundRotation to mass-produce nickel-metal hydride batteries for HEVs, marking the world’s first mass production of a hybrid electric vehicle.

• 1998

  Ultex unveils a new flip chip bonding technology using sound and heat.

• 2001

  A paper on the DSS Sound Flip Chip Bonder is featured at INTERNEPCON JAPAN.

• 2001

  Ultex’s flip chip technology is adopted by NEDO/ASET and published in 2003 as “Superfine Pitch Ultrasonic Bonding Technology on 3D Stacked LSI”.

• 2002

  Semiconductor manufacturers start using Ultex Sound Flip Chip Bonders to produce multi-bump IC packages.

• 2005

  A major Japanese automaker adopts Ultex SoundBonding technology to produce Power Control Units for HEVs.

• 2008

  SoundSoldering systems are implemented into power module assembly lines.

• 2011

  Another major Japanese automaker begins full-scale mass production of HEV lithium-ion batteries using Ultex SoundBonding systems.

• 2012

  Ultex SoundBonding technology enables bonding aluminium and copper parts thicker than 4 mm.

• 2013

  The Sound Ribbon Bonder is introduced, offering the ability to bond full metal ribbons.

• 2014

  SoundBonding systems are able to bond tin-plated parts for the first time.

• 2014

  Ultex systems enable bonding aluminium wire harnesses with cross-sections of up to 100 mm2.

• 2016

  Vertical Vibration Bonding (VVB) technology is developed, allowing dissimilar metals to be bonded through vertical vibrations.

• 2016

  Ultex introduces Clip Ingot Bonding (CIB), a damage-free SoundPower bonding technology.

• 2017

  Ultex successfully bonds four SiC elements to a heat sink simultaneously.

• 2017

  The Multi-Step Tool (MST) is developed, expanding CIB technology to allow bonding 100 layers of lithium-ion battery foil in two spots simultaneously.

• 2017

  A 3D hermetic seal bonding technique is developed for use with VVB and HVB technologies.

• 2019

  Energy Concentration Bonding (ECB) is introduced, allowing even steel parts to be bonded.

• 2019

  Ultex develops the Double Power System — the world’s most powerful sound bonding system capable of delivering up to 10 kW.

• 2020

  Ultex develops a SoundBonding technique that prevents hydrogen embrittlement in tin-plated steel.

• 2020

  Stitch Rotation, an intermittent rotary bonding method, is introduced.

• 2020

  Superconductors are successfully bonded using Ultex technology.

• 2020

  Heat sinks are bonded to multiple ceramic plates in a single step.

• 2020

  3D Seal Bonding technology is used to manufacture chiller tanks.

• 2021

  SoundBonding is used to achieve high-strength bonds between hot-dip galvanized HTSS parts.

• 2021

  Ultex develops SoundCutting, a cutting solution featuring an ultra-low-wear diamond blade.

• 2022

  VVB technology is used to bond and crimp 36 rivets on a ⌀100 mm aluminium plate simultaneously.

• 2023

  Aluminium and electrical steel plates are successfully bonded.

• 2023

  Ultex creates a technique to produce electrodes and terminals by bonding aluminium and copper plates and blocks.