Company
History
Ultex has continuously developed new SoundPower hardware and applications, introducing many world-first technologies along the way.
We keep pushing for ever more technological innovation and breakthroughs.
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1990
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1990
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1992
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1995
Sound Metal bonding system with ［Dual Support System］ is announced
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1997
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1998
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1998
<Flip-Chip> bonding technology with Sound and Heat horn is announced
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2000
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2000
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2002
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2005
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2008
Adoption of “Sound Soldering technology” in mass production of assembly
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2011
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2012
Bonding of Aluminum and Copper over 4mm thick becomes a possibility with Sound Metal Bonding system
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2013
“SoundBonding ribbon bonder” that bonding of metal ribbon becomes a possibility, is announced
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2014
<Bonding of Tin-plated parts> becomes a possibility with SoundBonding system
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2014
Bonding of <Aluminum wiring harness having 100sqmm> becomes a possibility with SoundBonding system
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2016
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2016
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2017
<Bonding of SiC elements to heat sink at 4 points by one shot> becomes a possibility
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2017
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2017
[3-dimensional hermetic sealing bonding] tech with VVB・HVB is developed
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2019
[Energy Concentration Bonding/ECB] tech becomes a possibility even in Steels bonding , is developed
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2019
[DoublePower system] that output about 10000 watt is the largest in the world is developed
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2020
2020 Intermittent vibration type [Stitch Rotation] which is Rotary bonding tech, is developed
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2020
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2020
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2020
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2020
Succeed in [3D Hermetic Bonding] of Assembly of cooling chiller tank structure
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2021
Succeed in <Very strong bonding of between Galvanized high-tensile strength steels >
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2021
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2022
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2023
Aluminium plate and electrical steel plate bonding becomes a possibility
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2023