Our MZ series sound bonding system, proven across numerous production lines.

• The Dual Support System (DSS) evenly supports the horn on both ends
• No contamination during bonding
• Rigid construction

Featuring a heated horn, combining heat with the power of sound.

Designed to bond semiconductor metal ribbons.

Equipped with two generators, this sound bonding system is capable of achieving an output of up to 10 kW.

Sound soldering system capable of lead-free dip tinning.

• No need for flux
• Allows tinning aluminium parts
• Solder bonds to parts by cavitation forming on part surfaces
• No damage to parts
• No erosion of the horn

A powered dip-cleaning system designed for superior cleaning power and zero part damage.

• Maintains a consistent cleaning frequency
• Fluid cavitation forms directly on part surfaces, creating a powerful cleaning effect
• No part damage
• No specialized cleaning liquids required

Consecutive bonding for elec- trodes of batteries
and others For speedy production lines This system
can also be used as batch type

• Rotation bonding machine

The Sound Stitch Rotation System combines our proven metal bonding and plastic welding rotation system with Ultex batch bonding technology. It features DSSR and an intermittent rotation system.

Diamond cutting machine for semiconductors and general difficult-to-cut materials

• Only water is used
• SiC can be cut
• No occurrence of built-up edge
• No need of dressing
• No need of LLC for cooling